Description

Exp: 2028-02/04

SKU: 56877

Cone Socket #4

Sub-micron particle size for superior polishability

Dentsply Prime & Bond NT Light Cure Adhesive Exp: 2028-02/04Prime and Bond NT Light Cure Adhesive Description Prime & Bond NT is a light cured, total etch bonding agent that contains nanofillers of amorphous silicon dioxide, di and tri methacrylate resins, PENTA (dipentaerythritol penta acrylate monophosphate), and acetone (solvent). It requires one application followed by a 10 second light cure. Prime & Bond NT is designed to bond composite materials to enamel and dentin. It is also indicated for the bonding

Exchange/Return Notes

We offer a 30-day return/exchange service after receiving.
Final sale items are not eligible for returns or exchanges.
To process your return/exchange, please contact us at [email protected]
Please click here for more details>>> Return & Exchange Policy

Dentsply Prime & Bond NT Light Cure Adhesive Exp: 2028-02/04

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