2 Pack 10g (20g in Total) HY910 0.975W/m-k Thermal Conductive Glue, High-Performance Thermal Plaster, Silicone Viscous Adhesive Cooling Compound, Heatsink Glue for LED GPU MOSFET 3D Printer IC Chipset industrial_Dec2022 Avoid that Ticket Using a

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2 Pack 10g (20g in Total) HY910 0.975W/m-k Thermal Conductive Glue, High-Performance Thermal Plaster, Silicone Viscous Adhesive Cooling Compound, Heatsink Glue for LED GPU MOSFET 3D Printer IC Chipset industrial_Dec2022 Avoid that Ticket Using a2 Pack 10g (20g in Total) HY910 0. 975W m k Thermal Conductive Glue, High Performance Thermal Plaster, Silicone Viscous Adhesive Cooling Compound, Heatsink Glue for LED GPU MOSFET 3D Printer IC Chipset Product Features High Thermal Conductivity With a thermal conductivity rate of 0. 975W m K, this thermal conductive glue helps disperse heat effectively from MOSFETs, LEDs, ICs, GPU chipsets, and other electronic components that require direct bonding.